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Advances in Radio Science An open-access journal of the U.R.S.I. Landesausschuss in der Bundesrepublik Deutschland e.V.
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Volume 9
Adv. Radio Sci., 9, 303-308, 2011
https://doi.org/10.5194/ars-9-303-2011
© Author(s) 2011. This work is distributed under
the Creative Commons Attribution 3.0 License.
Adv. Radio Sci., 9, 303-308, 2011
https://doi.org/10.5194/ars-9-303-2011
© Author(s) 2011. This work is distributed under
the Creative Commons Attribution 3.0 License.

  01 Aug 2011

01 Aug 2011

Coupling path influence on the conducted emission measurement results by the EMC semiconductor test board

M. Frick1, R. Eidher1, and R. Weigel2 M. Frick et al.
  • 1Engineering Electromagnetic Compatibility, Robert Bosch GmbH, Reutlingen, Germany
  • 2Institute for Electronics Engineering, Friedrich-Alexander-University of Erlangen-Nuremberg, Germany

Abstract. The fact of reduced development time in the automotive sector requires a change in the electromagnetic compatibility (EMC) validation of electronic components. To increase the development time of automotive components, e.g. sensors or electronic control units (ECUs), it is mandatory to verify the EMC behavior of the integrated circuit (IC) itself in an early development stage simultaneous to the development process of the entire ECU into which it is embedded. The conducted IC EMC tests emission as well as immunity is realized with a specific test printed circuit board (PCB) which is built according to the guidelines of the Bosch, Infineon, Siemens VDO Specification (BISS, 2007). The measurement results of these EMC tests are affected by the test PCB itself. To deduce the application requirements of the component from the application circuit of the test PCB it is necessary to consider this influence by the printed circuit board. The text at hand gives an overview on how far the emission results are adulterated by the used test PCB. The presented method also grants a validation of the disturbance voltage directly at the IC pin considering the application circuit.

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