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Advances in Radio Science An open-access journal of the U.R.S.I. Landesausschuss in der Bundesrepublik Deutschland e.V.
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Volume 12
Adv. Radio Sci., 12, 103-109, 2014
https://doi.org/10.5194/ars-12-103-2014
© Author(s) 2014. This work is distributed under
the Creative Commons Attribution 3.0 License.
Adv. Radio Sci., 12, 103-109, 2014
https://doi.org/10.5194/ars-12-103-2014
© Author(s) 2014. This work is distributed under
the Creative Commons Attribution 3.0 License.

  10 Nov 2014

10 Nov 2014

Temperature modeling and emulation of an ASIC temperature monitor system for Tightly-Coupled Processor Arrays (TCPAs)

E. Glocker1, S. Boppu2, Q. Chen3, U. Schlichtmann3, J. Teich2, and D. Schmitt-Landsiedel1 E. Glocker et al.
  • 1Lehrstuhl für Technische Elektronik, Technische Universität München (TUM), Theresienstr. 90, 80333 München, Germany
  • 2Lehrstuhl für Informatik 12 (Hardware-Software-Co-Design), Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU), Cauerstr. 11, 91058 Erlangen, Germany
  • 3Lehrstuhl für Entwurfsautomatisierung, Technische Universität München (TUM), Arcisstr. 21, 80333 München, Germany

Abstract. This contribution provides an approach for emulating the behaviour of an ASIC temperature monitoring system (TMon) during run-time for a tightly-coupled processor array (TCPA) of a heterogeneous invasive multi-tile architecture to be used for FPGA prototyping. It is based on a thermal RC modeling approach. Also different usage scenarios of TCPA are analyzed and compared.

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