Articles | Volume 11
https://doi.org/10.5194/ars-11-219-2013
https://doi.org/10.5194/ars-11-219-2013
04 Jul 2013
 | 04 Jul 2013

Modeling of temperature scenarios in a multicore processor system

E. Glocker and D. Schmitt-Landsiedel

Cited articles

Boehm, R. F.: Conduction Heat Transfer, in: The CRC Handbook of Thermal Engineering, edited by: Keith, F., CRC Press LLC, 2000.
Brooks, D. et al.: Power, Thermal, and Reliability Modeling in Nanometer-Scale Microprocessors, In IEEE Micro, Vol. 27, No. 3, 49–62, 2007.
Chandra, R.: Transient Temperature Analysis, Robuspic Workshop on European Solid-State Device Research Conference (ESSDERC), 2006.
Gunther, S. H. et al.: Managing the Impact of Increasing Microprocessor Power Consumption, In Intel Technology Journal first quarter 2001, 2001.
Huang, W., et. al.: Compact Thermal Modeling for Temperature-Aware Design, in: Proceedings Design Automation Conference, 878–883, 2004.
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