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<article language="en">
	<journal>
		<journal_title>Advances in Radio Science</journal_title>
		<journal_url>www.adv-radio-sci.net</journal_url>
		<issn>1684-9965</issn>
		<eissn>1684-9973</eissn>
		<volume_number>7</volume_number>
		<volume_title>Kleinheubacher Berichte 2008</volume_title>
		<publication_year>2009</publication_year>
	</journal>
	<doi>10.5194/ars-7-261-2009</doi>
	<article_url>http://www.adv-radio-sci.net/7/261/2009/</article_url>
	<abstract_html>http://www.adv-radio-sci.net/7/261/2009/ars-7-261-2009.html</abstract_html>
	<fulltext_pdf>http://www.adv-radio-sci.net/7/261/2009/ars-7-261-2009.pdf</fulltext_pdf>
	<start_page>261</start_page>
	<end_page>265</end_page>
	<publication_date>2009-05-19</publication_date>
	<article_title content_type="html">Coupling between Vias and the PCB Power-Bus</article_title>
	<authors>
		<author numeration="1" affiliations="1">
			<name>G. Heinrich</name>
			<email>gerd.heinrich@hsu-hamburg.de</email>
		</author>
		<author numeration="2" affiliations="1">
			<name>S. Dickmann</name>
		</author>
	</authors>
	<affiliations>
		<affiliation numeration="1" content_type="html">Faculty of Electrical Engineering, Helmut-Schmidt-Universität/Universität  der Bundeswehr Hamburg, Germany</affiliation>
	</affiliations>
	<abstract content_type="html">In this paper, a method for the extraction of data for a through-hole
vertical interconnect access (via) on a printed circuit board (PCB) is
presented. It uses a matrix de-embedding algorithm and two-port theory to
extract the elements of an assumed lumped via model. After that the influence
of the via on the power-bus impedance and the coupling between the via and the
power-bus are described using this model.</abstract>
	<references>
		<reference numeration="1" content_type="text"> Hampe, M. and Dickmann, S.: Damping of Cavity-Mode Resonances in PCB Power-Bus Structures Using Discrete Capacitors, IEEE T. Electromagn. C., 47, 880–880, 2005. </reference>
		<reference numeration="2" content_type="text"> Hampe, M. and Dickmann, S.: Single Summation Expression for the Impedance of Rectangular PCB Power-Bus Structures Loaded With Multiple Lumped Elements, IEEE T. Electromagn. C., 49, 58–67, 2007. </reference>
		<reference numeration="3" content_type="text"> Heinrich, G. and Dickmann, S.: On the Influence of Vias on the PCB Power-Bus, Proceedings of the International Symposium on EMC (EMC Europe 2008), Hamburg, 85–90, 2008 </reference>
		<reference numeration="4" content_type="text"> Lei, G.-T., Techentin, R. W., and Gilbert, B. K.: High-Frequency Characterization of Power/Ground-Plane Structures, IEEE Transactions on Microwave Theory and Techniques, 47, 562–569, 1999.  </reference>
		<reference numeration="5" content_type="text"> Antonini, G., Scogna, A. C., and Orlandi, A.: Equivalent Network Synthesis for Via Holes Discontinuities, IEEE Transactions on Advanced Packaging, 25, 528–536, 2002. </reference>
		<reference numeration="6" content_type="text"> Antonini, G., Scogna, A.C., and Orlandi, A.: S-Parameters Characterization of Through, Blind, and Buried Via Holes, IEEE Transactions on Mobile Computing, 2, 174–184, 2003. </reference>
		<reference numeration="7" content_type="text"> Antonini, G., Scogna, A. C., and Orlandi, A.: De-Embedding Procedure Based on Computed/Measured Data Set for PCB Structures Characterization, IEEE Transactions on Advanced Packaging, 27, 597–602, 2004. </reference>
		<reference numeration="8" content_type="text"> Okoshi, T.: Planar Circuits for Microwaves and Lightwaves, 1984. </reference>
		<reference numeration="9" content_type="text"> Gupta, K. C., Garg, R., and Bahl, I. J.: Microstrip lines and slotlines, Artech House Microwave Library, 87–90, 1979. </reference>
		<reference numeration="10" content_type="text"> Zinke, O. and Brunswig, H.: Hochfrequenztechnik I – Hochfrequenzfilter, Leistungen, Antennen, 6. Auflage, Springer-Verlag, 164–168, 2000. </reference>
		<reference numeration="11" content_type="text"> CST Microwave Studio: http://www.cst.com/Content/Products/MWS/Overview.aspx, 2009. </reference>
	</references>
</article>

