| Volumes Volume 7 Contents of Current Session |
www.adv-radio-sci.net/7/261/2009/
doi:10.5194/ars-7-261-2009
© Author(s) 2009. This work is distributed
under the Creative Commons Attribution 3.0 License.
Coupling between Vias and the PCB Power-Bus
Faculty of Electrical Engineering, Helmut-Schmidt-Universität/Universität der Bundeswehr Hamburg, Germany
Abstract. In this paper, a method for the extraction of data for a through-hole vertical interconnect access (via) on a printed circuit board (PCB) is presented. It uses a matrix de-embedding algorithm and two-port theory to extract the elements of an assumed lumped via model. After that the influence of the via on the power-bus impedance and the coupling between the via and the power-bus are described using this model.
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Citation: Heinrich, G. and Dickmann, S.: Coupling between Vias and the PCB Power-Bus, Adv. Radio Sci., 7, 261-265, doi:10.5194/ars-7-261-2009, 2009. Bibtex EndNote Reference Manager XML
