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<article language="en">
	<journal>
		<journal_title>Advances in Radio Science</journal_title>
		<journal_url>www.adv-radio-sci.net</journal_url>
		<issn>1684-9965</issn>
		<eissn>1684-9973</eissn>
		<volume_number>7</volume_number>
		<volume_title>Kleinheubacher Berichte 2008</volume_title>
		<publication_year>2009</publication_year>
	</journal>
	<doi>10.5194/ars-7-237-2009</doi>
	<article_url>http://www.adv-radio-sci.net/7/237/2009/</article_url>
	<abstract_html>http://www.adv-radio-sci.net/7/237/2009/ars-7-237-2009.html</abstract_html>
	<fulltext_pdf>http://www.adv-radio-sci.net/7/237/2009/ars-7-237-2009.pdf</fulltext_pdf>
	<start_page>237</start_page>
	<end_page>242</end_page>
	<publication_date>2009-05-19</publication_date>
	<article_title content_type="html">High-voltage (100 V) Chipfilm&lt;sup&gt;TM&lt;/sup&gt; single-crystal silicon LDMOS transistor for integrated driver circuits in flexible displays</article_title>
	<authors>
		<author numeration="1" affiliations="1,2">
			<name>A. Asif</name>
			<email>aliasif@ims-chips.de</email>
		</author>
		<author numeration="2" affiliations="2">
			<name>H. Richter</name>
		</author>
		<author numeration="3" affiliations="1,2">
			<name>J. N. Burghartz</name>
		</author>
	</authors>
	<affiliations>
		<affiliation numeration="1" content_type="html">Institut für Nano- und Mikroelektronische Systeme, Universität Stuttgart (INES), Elektrotechnisches Institut II, Pfaffenwaldring 47, 70569 Stuttgart, Germany</affiliation>
		<affiliation numeration="2" content_type="html">Institut für Mikroelektronik Stuttgart (IMS), Allmandring 30A, 70569 Stuttgart, Germany</affiliation>
	</affiliations>
	<abstract content_type="html">System-in-Foil (SiF) is an emerging field of large-area
polymer electronics that employs new materials such as conductive polymers
and electrophoretic micro-capsules (E-Ink) along with ultra-thin and thus
flexible chips. In flexible displays, the integration of gate and source
drivers onto the flexible part increases the yield and enhances the
reliability of the system.

&lt;br&gt;&lt;br&gt;
In this work we propose a high-voltage Chipfilm&lt;sup&gt;TM&lt;/sup&gt; lateral diffused MOS
transistor (LDMOS) structure on ultra-thin single-crystalline silicon chips.
The fabrication process is compatible with CMOS standard processing. This
LDMOS structure proves to be well suited for providing adequately large
switching voltages in spite of the thin (&amp;lt;10 μm) substrate. A
breakdown voltage of more than 100 volts with drain-to-source saturation
current I&lt;sub&gt;&lt;i&gt;ds&lt;/i&gt;(sat)&lt;/sub&gt;&amp;asymp;85 μA/μm for N-LDMOS and
I&lt;sub&gt;&lt;i&gt;ds&lt;/i&gt;(sat)&lt;/sub&gt;&amp;asymp;20 μA/μm for P-LDMOS is predicted through
process and device simulations.</abstract>
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</article>

