Advances in Radio Science www.adv-radio-sci.net 1684-9965 1684-9973 7 Kleinheubacher Berichte 2008 2009 10.5194/ars-7-11-2009 http://www.adv-radio-sci.net/7/11/2009/ http://www.adv-radio-sci.net/7/11/2009/ars-7-11-2009.html http://www.adv-radio-sci.net/7/11/2009/ars-7-11-2009.pdf 11 15 2009-05-18 Comparison of methods for broadband electromagnetic characterization of Molded Interconnect Device materials C. Orlob orlob@hft.uni-hannover.de D. Kornek S. Preihs I. Rolfes Leibniz Universität Hannover, Institut für Hochfrequenztechnik und Funksysteme, Appelstr. 9A, 30167 Hannover, Germany Combining the Molded Interconnect Device technology with the Laser Direct Structuring technology exhibits the potential of designing electrical and mechanical components on three-dimensional surfaces to increase functionality, level of integration and to reduce costs. When taking advantage of this technology especially in the design of RF devices, a precise knowledge of the electromagnetic parameters of the MID material is required, as the complex permeability and permittivity strongly influence the device performance. At present time, these materials are not electromagnetically characterized in the RF frequency range. In this paper different methods are therefore presented and compared with respect to their potentials for broadband electromagnetic characterization of Molded Interconnect Device materials. Arz, U. and Leinhos, J.: Broadband Permittivity Extraction from On-Wafer Scattering-Parameter Measurements, 12th IEEE Workshop on Signal Propagation on Interconnects, Avignon, France, 1–4, 2008. Baker-Jarvis, J., Vanzura, E. J., and Kissick, W. A.: Improved Technique for Determining Complex Permittivity with the Transmission/Reflection Method, IEEE T. Microw. Theory, 38, 1096–1103, 1990. Clarke, B., Gregory, A., Cannell, D., et al.: A Guide to the characterisation of dielectric materials at RF and microwave frequencies, National Physical Laboratory, Institute of Measurement and Control, London, 2003. Heinrich, W.: Quasi-TEM Description of MMIC Coplanar Lines Including Conductor-Loss Effects, IEEE T. Microw. Theory, 41, 45–52, 1993. Krupka, J., Derzakowski K., Riddle B., and Baker-Jarvis, J.: A dielectric resonator for measurements of complex permittivity of low loss dielectric materials as a function of temperature, Meas. Sci. Technol., 9, 1751–1756, 1998. Marks, R. B.: A Multiline Method of Network Analyzer Calibration, IEEE T. Microw. Theory, 39, 1205–1215, 1991. Nicolson, A. M. and Ross, G. F.: Measurement of the Intrinsic Properties of Materials by Time-Domain Techniques, IEEE T. Instrum. Meas., 19, 377–382, 1970. Schlueter, R., Roesener, B., Kickelhain, J., and Naundorf, G.: Completely Additive Laser-Based Process for the Production of 3D MIDs, The LPKF LDS Process, 5th International Congress Molded Interconnect Devices, Erlangen, Germany, 2002.