Articles | Volume 12
https://doi.org/10.5194/ars-12-103-2014
https://doi.org/10.5194/ars-12-103-2014
10 Nov 2014
 | 10 Nov 2014

Temperature modeling and emulation of an ASIC temperature monitor system for Tightly-Coupled Processor Arrays (TCPAs)

E. Glocker, S. Boppu, Q. Chen, U. Schlichtmann, J. Teich, and D. Schmitt-Landsiedel

Abstract. This contribution provides an approach for emulating the behaviour of an ASIC temperature monitoring system (TMon) during run-time for a tightly-coupled processor array (TCPA) of a heterogeneous invasive multi-tile architecture to be used for FPGA prototyping. It is based on a thermal RC modeling approach. Also different usage scenarios of TCPA are analyzed and compared.

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